Wire, Electronics & Component Identification

EC-08

PCB & Electronic Component Labels

This product is intended for electronics manufacturing, SMT, PCB assembly, test and quality-traceability teams.

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Product overview

What this product covers

This product is intended for electronics manufacturing, SMT, PCB assembly, test and quality-traceability teams. A small barcode or 2D code links PCB, subassembly and finished product to work order, lot, test and rework records. Confirm placement stage, solder or cleaning temperature, available area and scanner before stock, adhesive and symbology. Small high-resolution labels for printed circuit boards, components, assemblies and electronics production. PCB and component labels are selected around board process, placement stage, cleaning, soldering heat, flux and barcode density. Material and adhesive require qualification within the customer's manufacturing process. Small size, high data density and electronics-process exposure distinguish these labels from general product labels. Zheye controls metal plates, layout and variable data; polyimide, polyester and wire-marker materials are sourced by declared construction and process class. This page presents one standard model, EC-08-PI, in Polyimide. Dimensions, processes and acceptance notes on this page refer to this representative construction.

Applications

  • Printed circuit boards
  • Electronic assemblies
  • Component traceability

Buyers and teams

  • electronics manufacturing, SMT, PCB assembly, test and quality-traceability teams

Materials

  • Polyimide

Marking

  • Data Matrix
  • Barcode
  • Serial number
  • Lot and revision

Installation

  • Pressure-sensitive adhesive
  • Automated or manual placement

Specifications

FieldDocumented value
Placement stageBefore or after solder and cleaning
ProcessHeat, flux and cleaning chemicals supplied
Code densityPrinter resolution and scanner confirmed
SurfaceBoard mask, component or housing

Recommended project inputs

  1. PCB & Electronic Component Labels; PCB or assembly, placement stage, temperature and cleaning, data and symbology, print and scan equipment, size and quantity.
  2. State the identified object, material/surface, available space, orientation, holes/ties/adhesive/matched tool and provide a site photo where possible.
  3. Provide length, width/diameter, thickness, corners/edges, holes/slots, fit tolerances and any keep-clear or no-adhesive zones.
  4. Supply final text, units, graphics, colour, language, serial/barcode/RFID rule, human-readable data and one approved revision; numbers shown in sample images are never treated as production data.
  5. State temperature and dwell, indoor/outdoor use, UV, water, oil, cleaner/chemical, abrasion, vibration, read conditions or other real exposure together with test method and pass/fail criterion.
  6. Provide prototype and production quantity, start/end and permitted-gap rules, grouping, packing sequence, batch documents and target delivery.
  7. Where regulation, certification, permit, ethics, brand authorisation or customer specification applies, provide the applicable revision and owner-approved file; a product name or image cannot replace it.

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Discuss PCB & Electronic Component Labels

Include product code EC-08 with the project inputs that apply.

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